Dissemination
|
Title
|
Author
|
Project Partners Involved
|
Source
|
Date
|
Resource
|
|---|---|---|---|---|---|
|
AISSI Platform Interface Specification
|
|
Robert Bosch GmbH, D-SIMLAB Technologies Pte Ltd
|
AISSI project
|
02.05.2024
|
|
|
Demonstration on how to use the AISSI Platform Interface Specification
|
|
Robert Bosch GmbH, D-SIMLAB Technologies Pte Ltd
|
AISSI project
|
02.05.2024
|
|
Title
|
Author
|
Project Partners Involved
|
Source
|
Date
|
Resource
|
|---|---|---|---|---|---|
|
Graph Representation and Embedding for Semiconductor Manufacturing Fab States
|
B. Schulz,
C. Jacobi,
A. Gisbrecht,
A. Evangelos,
C. Chan,
B. Gan
|
Karlsruhe Institute of Technology (KIT), Robert Bosch GmbH, D-SIMLAB Technologies Pte Ltd)
|
IEEE
|
23.01.2023
|
|
|
To batch or not to batch? Real-time continuous batch optimization in a semiconductor work center environment
|
H. Brandl,
P. Rossbach, H. Terbrack |
Systema GmbH
|
20. ASIM
Dedicated Conference on Simulation in Production and Logistics |
14.09.2023
|
|
|
Halbleiteroffensive mit KI(T) (german)
|
K. Janz
|
Karlsruhe Institute of Technology (KIT), Robert Bosch GmbH
|
KIT-NEULAND Magazin
|
01.12.2023
|
|
|
Mobilizing semiconductor factories with AI
|
K. Janz,
C. Jacobi, A. Gisbrecht |
Karlsruhe Institute of Technology (KIT), Robert Bosch GmbH
|
KIT RESEARCH TO BUSINESS
|
09.01.2024
|
|
Title
|
Author
|
Project Partners Involved
|
Source
|
Date
|
Resource
|
|---|---|---|---|---|---|
|
Updated State-of-the-Art analysis
(D1.1)
|
C. Jacobi,
B. Schulz
|
Karlsruhe Institute of Technology (KIT)
|
AISSI project
WP 1 |
21.10.2021
|
|
|
Intermediate report on dissemination activities
(D4.1)
|
B. Schulz,
C. Senger, K. Leonardi, G. Luhn, A. Gisbrecht |
Karlsruhe Institute of Technology (KIT),
Nexperia GmbH, Systema GmbH, Robert Bosch GmbH
|
AISSI project
WP 4 |
30.11.2022
|
|
Title
|
Author
|
Project Partners Involved
|
Source
|
Date
|
Resource
|
|---|---|---|---|---|---|
|
Session III – AI application develop- ment | DataOps vs. DevOps |
A. Gisbrecht |
Robert Bosch GmbH |
ITEA Smart Systems Engineering work- shop (session replay) |
07.04.2022 |
|
|
Maximizing throughput, due date
compliance and other partially conflicting objectives in semiconductor production |
H. Brandl,
H. Terbrack, P. Roßbach, T. Sprogies |
SYSTEMA GmbH,
Nexperia Germany GmbH |
Winter Simulation
Conference |
12.12.2022
|
|
|
Graph Representation and Embedding
for Semiconductor Manufacturing Fab States |
B. Schulz,
C. Jacobi, A. Gisbrecht, E. Angelidis, C. W. Chan, B.P. Gan |
Karlsruhe Institute of Technology (KIT),
Robert Bosch GmbH, D-SIMLAB Technologies Pte Ltd |
Winter Simulation
Conference |
13.12.2022
|
|
|
Optimizing semiconductor production
using AI and scheduling to balance competing goals |
H. Brandl
|
Systema GmbH, Nexperia GmbH
|
20th Innovation Forum
for Automation |
27.01.2023
|
|
|
Make more money by modeling
and optimizing your business processes with Kotlin |
H. Brandl
|
Systema GmbH
|
KotlinConf’23
|
14.04.2023
|
|
|
Sustainability is the new normal in
high-volume semiconductor front end production: Balancing WIP flow for energy availability, cost and peak consumption |
H. Terbrack,
H. Brandl, T. Sprogies, K. Leonardi |
Systema GmbH, Nexperia Germany GmbH
|
16.-18.04.2024
|
